JESD22 - A101B PDF

Yozshurn Wireless sensor network WSN is an important wireless technology that has wide variety of applications and provides unlimited future potentials for IOT. If the biasing configuration cycled bias, when optimized for a specific device type, will be more severe than continuous bias. Condensation shall be avoided by ensuring that the test chamber dry bulb temperature exceeds the wet-bulb temperature at all times. The rate of moisture loss from devices after removal from the chamber can be reduced by placing the devices in sealed moisture barrier bags without desiccant. Abstract Recent empirical work has shown that ongoing. It employs conditions of temperature, humidity, and bias which accelerate the penetration of moisture through the external protective material encapsulant or seal or along the inteface between the external protective material and the metallic conductors which pass through it.

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JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.

JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met.

Published by? By downloading this file the individual agrees not to charge for or resell the resulting material. Temperature, humidity, and bias conditions are applied to accelerate the penetration of moisture through the external protective material encapsulant or seal or along the interface between the external protective material and the metallic conductors which pass through it.

NOTE Care should be taken to ensure the test chamber dry-bulb temperature exceeds the wet-bulb temperature at all times. NOTE Care should be taken to minimize relative humidity gradients and maximize air flow between devices. For information only. NOTE 3 The test conditions are to be applied continuously except during any interim readouts.

For interim readouts, devices should be returned to stress within the time specified in 4. NOTE The priority of the above guidelines depends on mechanism and specific device characteristics.

If the die temperature is not known, when the heat dissipation of the device under test DUT is less than mW. If the heat dissipation of the DUT exceeds mW, then the die temperature should be calculated. Heating as a result of power dissipation tends to drive moisture away from the die and thereby hinders moisture-related failure mechanisms.

Cycled bias permits moisture collection on the die during the off periods when device power dissipation does not occur. Cycling the DUT bias with one hour on and one hour off is optimal for most plastic-encapsulated microcircuits.

No Yes Yes1 Yes Cycling the DUT bias with one hour on and one hour off is optimal for most plasticencapsulated microcircuits 1 4 Procedures The test devices shall be mounted in a manner that exposes them to a specified condition of temperature and humidity with a specified electrical biasing condition. Exposure of devices to excessively hot, dry ambient or conditions that result in condensation on devices and electrical fixtures shall be avoided, particularly during ramp-up and ramp-down. Appropriate attention should also be made to avoid any water dripping on the devices under stress.

Condensation shall be avoided by ensuring that the test chamber dry-bulb temperature exceeds the wetbulb temperature at all times during ramp-down. Bias should be verified after devices are loaded, prior to the start of the test clock.

Bias should also be verified after the test clock stops, but before devices are removed from the chamber. For intermediate readouts, devices shall be returned to stress within 96 hours of the end of ramp-down.

The rate of moisture loss from devices after removal from the chamber can be reduced by placing the devices in sealed moisture barrier bags without desiccant. Thus the test window can be extended to as much as hours, and the time to return to stress to as much as hours by enclosing the devices in moisture-proof bags. NOTE 1 current. NOTE 2 The electrical test parameters should be chosen to preserve any defect i.

Contamination control is important in any accelerated moisture stress test. Specific failure criteria may be found in other applicable document or data sheet. This corrects an error made in JESDAC when the order of the numbers was reversed, but the order of the units in the heading was not.

Removed NOTE 4. Added note. Added reference 1. Reworded second paragraph. Reworded paragraph. All comments will be collected and dispersed to the appropriate committee s.

I recommend changes to the following: Requirement, clause number Test method number Clause number Fax: Recommendations for correction: 3.

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